Based on our popular DST3 system, the DST2-TG is a modified version for use in Glove Boxes. DST2-TG contains two sputtering cathodes and one thermal evaporation source, with an overall three deposition sources accessible. By using the deposition systems inside a glove box, the vacuum level can be highly controlled, suitable for deposition of oxidizing coatings.  Carbon deposition is also made possible by loading carbon fiber on the high-current electrodes.

With a dual pumping system consisting of an external vacuum pump (included) and a directly attached TMP (turbo molecular pump), the DST2-TG Series achieve vacuum in the micro-Torr range allowing very fine grain thin films to be applied to a multitude of substrates.  Uniform thin films with superior fine-grain sizes are formed in a fast cycle time suitable for advanced materials research and high magnification scanning electron microscopy.

The DST2-TG systems are equipped with a large chamber (300 mm diameter) with two 2” diameter water-cooled cathodes and a single channel thermal evaporation making it suitable for long time deposition. The system can be equipped with RF and DC power supplies. The RF sputtering option allows sputtering semiconductors, dielectrics and metal (oxidizing & noble) targets. The RF system is equipped with an auto adjustable matching box, minimizing the reflected power in the RF sputtering process. For increasing film adhesion to the substrate and to improve the film structures, a 300 V, DC bias voltage can be applied to the substrate (optional) or an optional heater allows substrate heating up to 500°C.  Likewise, an optional plasma cleaner can be used inside the chamber to facilitate substrate cleaning prior to coating. Two mass flow controlled (MFC) gas inputs allow precise gas flow control into the chamber.