High Vacuum Multiple Source Sputter Coaters 

DST3 Triple Source Sputter Coater and Thermal Evaporation

Our desktop Multiple Source Sputter Coaters provide materials research scientists a highly flexible tool for producing thin film specimens in a wide variety of formats with its Triple Sputtering source or optional Thermal Evaporation module.  Sputtering can occur sequentially or simultaneously from multiple heads to either create thin film alloys or to coat large areas more effectively.  The magnetron cathodes are water cooled to allow long coating times for thicker films than traditional compact sputter coaters will allow.   A variety of models are available to choose from that can be configured for a multitude of operations:

  • DST3-A:  Sputter Only – Angled Cathodes
  • DST3-S:   Sputter Only – Straight Cathodes
  • DST3-TA:  Sputter + Thermal Evaporation – Angled Cathodes
  • DST3-TS:  Sputter + Thermal Evaporation – Straight Cathodes
  • DST2-A:  lower priced 2 head sputter only system

With a dual pumping system consisting of an external vacuum pump (included) and a directly attached TMP (turbo molecular pump), the DST3 Series achieve vacuum in the micro-Torr range allowing very fine grain thin films to be applied to a multitude of substrates.  Uniform thin films with superior fine-grain sizes are formed in a fast cycle time suitable for advanced materials research and high magnification scanning electron microscopy.

The DST3 systems are equipped with a large chamber (300 mm diameter) and three 2” diameter water-cooled cathodes making it suitable for long time deposition. The system is equipped with RF and DC power supplies. It can sputter semiconductors, dielectrics and metal (oxidizing & noble) targets. The system is equipped with an auto adjustable matching box, minimizing the reflected power in the RF sputtering process. For increasing film adhesion to the substrate and to improve the film structures, a 300 V, DC bias voltage can be applied to the substrate (optional) or an optional heater allows substrate heating up to 500°C.  Two mass flow controlled (MFC) gas inputs allow precise gas flow control into the chamber.

The DST3-T systems include a Thermal Evaporation capability to supplement the sputtering process, providing further flexibility in the coating process.